Process Tape
제품소개
Bump wafer B/G
- UV Tape for High bump Wafer back grinding
- Below tapes are designed for surface protection wafers during back grinding process
- Easily de-taping from wafer without stress after UV irradiation.
- Pitch of Ball(100~300㎛)’s securing a stable process
Heat-resistance Tape
- Heat-resistance PCB or Cu-L/F Backside Polyimide Adhesive Tape
- Heat-resistance Glass substrate process tape
- For Semiconductor Packages to prevent resin leaking.
- UV Tape for High bump Wafer back grinding
UV / NON UV Tape
- UV & Non UV for wafer Back Grinding , sawing
- Below tapes are designed for surface protection wafers during B/G or sawing process
- LED, PCB for module dicing
- Excellent Expanding & Stable Chemical resistance
- Optimized adhesive strength works easy de-taping without stress.c
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